There are three main types of soldering methods available for automatic soldering machines: spot, drag and pressure soldering. The manufacturer of the soldering machine will decide the soldering method according to the characteristics of the customer's product and give the corresponding soldering solution. How the manufacturer of soldering machine decides the soldering method specifically according to the product characteristics:
Spot welding: The product has uneven solder joints and requires full solder joints. In this case, the welding method of spot welding will be selected, such as the spot welding of pcb board.
The main way to choose the product spot welding with soldering machine is uneven distribution of solder joints or high requirements for solder joint fullness. There is also a situation where the product has an even distribution of solder joints, but the insert needs to be fixed, so one of the joints needs to be fixed before soldering. In this case, spot welding is very efficient. Generally speaking, whether it is electronic chip soldering, device soldering or spot welding, many products have uneven solder joints and have different requirements for tin plating.
Drag soldering: Products with uniformly distributed solder joints require fixed inserts. There are two ways to use drag soldering.
Soldering machine choose drag welding method for welding, mainly because of the uniform distribution of solder joints, solder joint spacing is greater than 0.1 mm. These products require fixed inserts. If the direct distance between two solder joints is less than 0.1 mm, no fixing insert is required. If drag soldering is used, this can lead to problems with the connection of tin to the product. These products can be soldered as fast as possible using wave soldering or reflow soldering. The advantage of drag soldering is that it saves time and improves the soldering efficiency of the automatic soldering machine.
Soldering: Product solder has stretching requirements and relatively uniform solder joints.
Pressure welding in the solder joint test mainly requires tensile force, uniform distribution of solder joints. For products without plug-ins, pressure soldering can be used. If you use wave soldering or reflow soldering, for products with tensile requirements, try to use the soldering machine for soldering, so that customers with tensile requirements for product soldering are more secure.
Reasons for low soldering quality of soldering machine:
1. Cold welding
In the soldering machine welding process, the soldering iron temperature is too low or insufficient heating time, the solder is not completely melted and soaked, or the solder surface is not bright and cracked.
2. Excessive solder
The tin deposits that form the solder joint; if the amount of tin in the soldering machine is too small, not enough to wrap the solder joint.
3. Sharp spikes formed by the solder on the surface of the solder joint.
This is mostly caused by the soldering machine heating temperature or flux is insufficient, the soldering iron leaves the solder joint at an improper angle.
4. There is a layer of rosin between the solder and the component or printing plate, resulting in poor electrical contact.
If the mixture is not heated enough rosin, there is a layer of yellowish-brown rosin film under the solder joint; if the temperature is too high, the rosin will turn black. For both cases, the former can be repaired with a soldering iron. For carbonized products, it is necessary to refill the tin, clean the soldered parts or printed surfaces, and re-solder.
5. Too much flux around the solder joint, too much rosin residue
When a small amount of rosin residue, gently heat with an iron to make the rosin volatile, or use a cotton ball dipped in anhydrous alcohol to wipe away excess rosin or flux.
6. More solder
Soldering machine solder too much will lead to short circuits between the component solder joints. In the soldering machine automatically solder ultra-small components and micro printed circuit boards, should pay special attention to this point.
